Power chips are connected to outside circuits with product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is generally light weight aluminum bonding cable in typical modules. ^ Conventional power component bundle cross-section Currently, industrial silicon carbide power components still mainly use the product packaging technology of this wire-bonded traditional silicon IGBT component. They encounter problems such as large high-frequency parasitical specifications, not enough heat dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit the use...

As one more important landmark in China's operated spaceflight task, the effective launch of Shenzhou 17 not just notes one more leap in China's aerospace market however additionally demonstrates China's superior success in aerospace materials science and technology. Among them, the selection of alloys and the application of producing innovation are undoubtedly essential factors behind the success of Shenzhou 17 that can not be disregarded. ...

Power chips are connected to outside circuits with product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power...

As one more important landmark in China's operated spaceflight task, the effective launch of Shenzhou 17 not just notes one more leap in China's...