From August 14th to 16th, the Globe OF CONCRETE ASIA 2024 (WOCA) will be held at the Shanghai New International Exposition Facility, China. Luoyang Tongrun Info Innovation Co., Ltd will participate in the event( Booth Number: E1C01). The product will certainly cover a range of applications, such as concrete foaming representatives, polycarboxylate superplasticizers, and instant sodium silicate powder, in order to explore even more service chances with brand-new and old consumers. ...

Power chips are connected to outside circuits with product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power chips are usually packaged as power modules. Chip interconnection refers to the electrical connection on the top surface area of the chip, which is generally light weight aluminum bonding cable in typical modules. ^ Conventional power component bundle cross-section Currently, industrial silicon carbide power components still mainly use the product packaging technology of this wire-bonded traditional silicon IGBT component. They encounter problems such as large high-frequency parasitical specifications, not enough heat dissipation ability, low-temperature resistance, and not enough insulation stamina, which limit the use...

From August 14th to 16th, the Globe OF CONCRETE ASIA 2024 (WOCA) will be held at the Shanghai New International Exposition Facility, China. Luoyang...

Power chips are connected to outside circuits with product packaging, and their performance depends upon the support of the packaging. In high-power circumstances, power...